Inline 3D-CT Inspection in Battery Production

Xnovo inline 3D-CT inspection for battery production

Inline 3D Inspection for Battery Production

Reliable defect detection at production speed.

 


Discuss a Feasibility Assessment

Short CT scan times can make small metallic inclusions difficult to distinguish from image noise,
reconstruction artefacts and surrounding cell structures. XNspect solution combines advanced
analytical image processing and AI to evaluate challenging 3D-CT data under production-relevant conditions.


Engineered for Your Exact Specifications

Unlike rigid, off-the-shelf software that rarely match unique factory requirements 100%, we deliver highly customized hardware-agnostic 3D-CT inspection solutions tailored to exactly fulfill your specific production demands, cycle times, and defect criteria.

Small Inclusions
Focus on challenging metallic defects
Multi-Stage Analysis
Advanced analytical processing and AI methods
Production Integration
Designed around cycle time and plant requirements

Challenging Defect Cases

Detection depends on the material, defect location and surrounding cell structure. These examples illustrate
why identifying metallic inclusions requires more than a simple threshold on image intensity.

Engineered test cell samples used for analysis validation; not from serial production.

Jelly-roll CT case showing how a small inclusion can blend into background noise

Jelly roll — small inclusions

An inclusion only a few voxels across can be difficult to distinguish from background variation.
Detection sensitivity depends on scan and reconstruction conditions as well as the analysis method.

Battery can CT case illustrating low-contrast particles near the dense housing edge

Battery can — beam hardening

The housing region is dominated by imaging artefacts from the high-density steel casing.
Reliable inspection must separate a true inclusion from the surrounding artefact pattern.

Battery tab CT case illustrating micro-spatter that can resemble inclusions

Battery tab — weld micro-spatter

Real inclusions must be distinguished from process-related structures that can have a similar appearance in CT data.

Conductor CT case showing folded and overlapping structures around possible defect indications

Conductor — complex structures

Folded or overlapping conductor structures can mask small indications.
Analysis must consider the local image context.

A Multi-Stage Approach

XNspect combines advanced detection methods to address different defect signatures
while accounting for the data and processing constraints of production inspection.

Analytical image processing

Analytical processing prepares and transforms CT data to support efficient analysis of relevant structures.

Fast 3D classification

A 3D classification network evaluates candidate defect regions to help distinguish relevant indications
from other structures in the volume.

Anomaly detection

Anomaly detection identifies regions that differ from learned patterns of normal data, helping identify
indications that may not be represented in the training data.

Image Quality vs. Production Speed

Shorter scan times support production throughput but can reduce defect contrast, making small inclusions
harder to distinguish from noise and surrounding structures. Xnovo combines analytical processing with AI
methods to extract useful defect information from challenging production scans.

Illustrative sensitivity trend across laboratory, at-line and inline inspection conditions

Built for Production

Inspection performance depends on more than detection algorithms. The workflow must fit the available
CT data, target cycle time, manufacturing interfaces and traceability requirements.

Processing performance

Cycle time

Processing can be distributed across available CPU and GPU resources and focused on relevant regions.
Actual throughput should be evaluated on representative data and target hardware.

CT data compatibility

System fit

XNspect can be evaluated with volume data from the customer’s CT infrastructure. Supported formats
and configuration should be confirmed for each deployment.

Factory and quality interfaces

Integration

Inspection outputs can be connected to relevant production and quality workflows. Confirm interface
availability, including OPC UA, PLC and Q-DAS connectivity, for the proposed configuration.

Traceability and reporting

Quality records

Inspection results can be associated with CT data and production records according to the customer’s
traceability, reporting and alerting requirements.

Feasibility to Production

The project can progress in stages, with technical results and requirements reviewed before moving
to the next level of integration.

Phase 1 — Feasibility

Evaluate representative CT data against agreed defect criteria, reviewing detection results,
false positives, missed indications and data suitability.

Phase 2 — Integration

Connect the analysis to the intended CT workflow and evaluate throughput on target hardware
against the required cycle time.

Phase 3 — Production validation

Validate the end-to-end workflow in an agreed at-line or inline setup using production-relevant scans,
acceptance criteria and required manufacturing or quality interfaces.

Evaluate XNspect on Your CT Data

Discuss your target defect types, scan conditions and cycle-time requirements with our team.
Together, we can determine whether a feasibility assessment is the right next step.


Discuss a Feasibility Assessment

Related material

Press Release – Xnovo Technology Deploys AI-Powered 3D-CT Inspection Solution at the BMW Group’s Cell Manufacturing Competence Centre

We use cookies!

At this site we use cookies to enhance the user experience and for tracking purposes. By using this site you accept the use of cookies.

Read more about cookies here.