Meet us at THERMEC 2018

Xnovo will be attending THERMEC 2018, the International Conference on Processing & Manufacturing of Advanced Materials. Learn more about our technology through an applied example:

Accessing 3D Grain Boundary Characteristics with LabDCT

Florian Bachmann
Session F1: Interfaces, Grain Boundaries & Structural Characterisation
Monday July 9th at 13:10

THERMEC 2018, 8-13 July 2018, Paris, France, see full program